Advanced Chip Packaging & Testing
Geography: Asia Pacific · Southeast Asia · Southeast Asia
Vietnam — Advanced semiconductor packaging, assembly, and testing (ATP) has become Vietnam's anchor in the global chip supply chain. Intel Products Vietnam in Ho Chi Minh City is the company's largest assembly and test facility worldwide, with Samsung and Amkor also operating major packaging operations. The National Semiconductor Strategy 2024-2030 targets $31 billion in semiconductor revenue by 2027.
The strategic context shifted dramatically in early 2026 when the US removed Cold War-era technology restrictions on Vietnam, clearing the path for the country to move beyond back-end assembly into wafer fabrication and IC design. This repositions Vietnam from a cost-competitive alternative to China into a genuine semiconductor manufacturing partner for the US ecosystem.
The implications are global: as companies accelerate China-plus-one strategies, Vietnam's combination of young engineering talent (500,000+ STEM graduates annually), competitive labor costs, and newly unlocked technology access creates a semiconductor corridor that could rival Malaysia's Penang within a decade. The risk is execution — building fab-grade infrastructure and retaining talent against regional competition.
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