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  4. Rapidus 2nm Chip Manufacturing

Rapidus 2nm Chip Manufacturing

Rapidus produced working 2nm prototypes in 2025 with IBM technology — targeting mass production in Hokkaido by 2027, backed by ¥267.6 billion in government-private funding.

Geography: Asia Pacific · East Asia · Japan

Back to SubstrateBack to JapanView interactive version

Rapidus Corporation, founded in 2022 with backing from Toyota, Sony, NTT, NEC, SoftBank, MUFG, Kioxia, and Denso, is Japan's bid to return to cutting-edge semiconductor manufacturing after a two-decade absence. In collaboration with IBM and imec, Rapidus produced working 2nm chip prototypes in 2025 at unprecedented speed — showcased to customers in July 2025. In February 2026, the company secured ¥267.6 billion ($1.7 billion) in combined government and private sector funding.

The Rapidus fab, IIM-1 (Innovative Integration for Manufacturing), is under construction in Chitose, Hokkaido. The company is pursuing a gate-all-around (GAA) nanosheet architecture for its 2nm process, using IBM's technology transfer. The target is pilot production by late 2025 and mass production by 2027 — an extremely ambitious timeline that would make Rapidus roughly concurrent with TSMC and Samsung at the 2nm node.

The strategic significance is immense: Japan has not manufactured leading-edge logic chips since the 1990s. Rapidus represents a national project to regain sovereignty over advanced chip production, driven by geopolitical concerns about Taiwan dependence and the AI computing boom. Skeptics question whether Rapidus can close a 20-year gap in manufacturing experience, but the IBM partnership provides process technology, and Japan's existing materials and equipment ecosystem provides the surrounding supply chain. Success would be transformative; failure would be an extremely expensive lesson.

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