Next-Gen Connectivity

Next-generation connectivity technologies are preparing for 6G networks and beyond, including terahertz (THz) communication systems operating at frequencies above 100 GHz, specialized substrates optimized for high-frequency signal propagation, and reconfigurable intelligent surfaces (RIS) that can dynamically control radio wave propagation. These technologies promise to deliver ultra-high data rates, extremely low latency, and massive device connectivity.

Terahertz communications enable data rates in the terabits per second range, suitable for applications like wireless data centers, ultra-high-definition video streaming, and real-time holographic communication. Reconfigurable intelligent surfaces are metasurfaces that can be electronically controlled to reflect, refract, or absorb radio waves, enabling dynamic optimization of wireless coverage and capacity. 6G-ready substrates use advanced materials and manufacturing techniques to minimize signal loss at extremely high frequencies. Together, these technologies form the foundation for future wireless networks that will support advanced applications like extended reality, autonomous systems, and ubiquitous AI.