High-Performance Memory & Interconnects

High-performance memory and interconnects include HBM3E (High Bandwidth Memory 3E), which stacks memory dies vertically and connects them through silicon vias, delivering exceptional bandwidth for AI and data-intensive workloads. CXL (Compute Express Link) enables memory expansion and pooling, allowing systems to share memory resources across processors and accelerators efficiently. 224G SerDes (Serializer/Deserializer) technology provides ultra-high-speed serial data transmission at 224 gigabits per second per lane, enabling massive data throughput for interconnects.

These technologies are critical for AI training, high-performance computing, data centers, and advanced graphics applications where memory bandwidth and interconnect speed are bottlenecks. HBM3E provides the highest memory bandwidth available, CXL enables flexible memory architectures, and 224G SerDes supports next-generation data center interconnects. Together, they enable systems to process massive datasets, train large AI models, and handle real-time data-intensive applications that require both high memory bandwidth and fast data movement between components.